Invention Grant
- Patent Title: Multilayer OPC for design aware manufacturing
- Patent Title (中): 多层OPC用于设计感知制造
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Application No.: US12357648Application Date: 2009-01-22
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Publication No.: US08214770B2Publication Date: 2012-07-03
- Inventor: Maharaj Mukherjee , James A. Culp , Lars Liebmann , Scott M. Mansfield
- Applicant: Maharaj Mukherjee , James A. Culp , Lars Liebmann , Scott M. Mansfield
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Catherine Ivers; Katherine S. Brown
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
A method is provided for designing a mask layout for an integrated circuit that ensures proper functional interaction among circuit features by including functional inter-layer and intra-layer constraints on the wafer. The functional constraints used according to the present invention are applied among the simulated wafer images to ensure proper functional interaction, while relaxing or eliminating the EPE constraints on the location of the wafer images.
Public/Granted literature
- US20090125868A1 MULTILAYER OPC FOR DESIGN AWARE MANUFACTURING Public/Granted day:2009-05-14
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