发明授权
- 专利标题: Method of manufacturing a printed circuit board
- 专利标题(中): 印刷电路板的制造方法
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申请号: US12320742申请日: 2009-02-03
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公开(公告)号: US08215010B2公开(公告)日: 2012-07-10
- 发明人: Sung-II Oh , Jae-Woo Joung , Tae-Hoon Kim , Sung-Nam Cho
- 申请人: Sung-II Oh , Jae-Woo Joung , Tae-Hoon Kim , Sung-Nam Cho
- 申请人地址: KR Suwon
- 专利权人: Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人: Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人地址: KR Suwon
- 优先权: KR10-2008-0043201 20080509
- 主分类号: H05K3/02
- IPC分类号: H05K3/02
摘要:
A printed circuit board and a manufacturing method thereof are disclosed. The method of manufacturing a printed circuit board can include: forming surface roughness on an insulation layer, coating a chemical compound onto the insulation layer that lowers the surface energy of the insulation layer, and forming a circuit pattern by inkjet printing on the insulation layer coated with the chemical compound. Certain embodiments of the invention can be utilized to improve adhesive strength between the insulation layer and the inkjet-printed circuit patterns, suppress spreading in the inkjet-printed circuit patterns to improve resolution, and reduce manufacturing costs by forming the circuits using inkjet printing.
公开/授权文献
- US20090277674A1 Printed circuit board and manufacturing method thereof 公开/授权日:2009-11-12