A multi-chip package is provided. The multi-chip package includes: a first semiconductor chip including first circuitry, a first chip terminal in communication with the first circuitry, a first surface, and conductor means for transmitting at least one of a signal and power; a second semiconductor chip attached above the first surface of the first semiconductor chip, the second semiconductor chip including second circuitry and a second chip terminal in communication with the second circuitry; and an electrical connection connecting the second chip terminal of the second semiconductor chip to the conductor means of the first semiconductor chip; wherein the conductor means is dedicated to the second semiconductor chip and does not transmit either a signal or power to or from the remainder of the first semiconductor chip.