发明授权
- 专利标题: Cover mechanism and electronic device using same
- 专利标题(中): 封盖机构和电子设备使用相同
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申请号: US12339274申请日: 2008-12-19
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公开(公告)号: US08218314B2公开(公告)日: 2012-07-10
- 发明人: Mu-Wen Yang , Chih-Chiang Chang , Chia-Wei Hu
- 申请人: Mu-Wen Yang , Chih-Chiang Chang , Chia-Wei Hu
- 申请人地址: HK Kowloon
- 专利权人: FIH (Hong Kong) Limited
- 当前专利权人: FIH (Hong Kong) Limited
- 当前专利权人地址: HK Kowloon
- 代理机构: Altis Law Group, Inc.
- 优先权: CN200810301305 20080425
- 主分类号: H05K5/00
- IPC分类号: H05K5/00
摘要:
An electronic device using a cover mechanism to cover a hole is described. The cover mechanism includes a base member, a cover member and a retaining member. The cover member is fixed with the retaining member and moves between a closed position and an opened position. In the closed position, the cover member is elastically, partially deformed to lock to the base member. In the opened position, the cover member can be elastically bent to expose the hole while still being physically attached to the base member.
公开/授权文献
- US20090270145A1 COVER MECHANISM AND ELECTRONIC DEVICE USING SAME 公开/授权日:2009-10-29