- 专利标题: Medical device packaging system
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申请号: US12825798申请日: 2010-06-29
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公开(公告)号: US08219200B2公开(公告)日: 2012-07-10
- 发明人: William K. Wenger , Paul G. Krause , William J. Plombon , Steven N. Lu , Sean B. McAdams , Brian B. Lee , Lee Stylos , Judy B. Salzer , G. Jordan Montgomery
- 申请人: William K. Wenger , Paul G. Krause , William J. Plombon , Steven N. Lu , Sean B. McAdams , Brian B. Lee , Lee Stylos , Judy B. Salzer , G. Jordan Montgomery
- 申请人地址: US MN Minneapolis
- 专利权人: Medtronic, Inc.
- 当前专利权人: Medtronic, Inc.
- 当前专利权人地址: US MN Minneapolis
- 代理商 Reed A. Duthler; Stephen W. Bauer; Evans M. Mburu
- 主分类号: A61N1/375
- IPC分类号: A61N1/375
摘要:
A system, comprising a sterilizable package; an implantable medical device placed inside the sterilizable package; and an electrical interface electrically coupled to the implantable medical device and extending from inside the sterilizable package to outside the sterilizable package. In various embodiments, the interface may include package contacts electrically coupled to electrode terminals on the implantable medical device, patient terminals and conductors extending between the package contacts and the patient terminals.
公开/授权文献
- US20110004265A1 MEDICAL DEVICE PACKAGING SYSTEM 公开/授权日:2011-01-06
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