Invention Grant
- Patent Title: Method of forming a housing component
- Patent Title (中): 形成外壳部件的方法
-
Application No.: US12240436Application Date: 2008-09-29
-
Publication No.: US08220142B2Publication Date: 2012-07-17
- Inventor: Way Chet Lim
- Applicant: Way Chet Lim
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Kramer Levin Naftalis & Frankel LLP
- Main IPC: H01R43/00
- IPC: H01R43/00
Abstract:
Electronic devices are provided with housing components that have improved aesthetics. One or more holes may be formed through a portion of the housing and then the housing portion may be anodized. The anodization process may increase or decrease the geometries of each hole. The holes may be formed through the housing portion from a cosmetic side of the housing portion to an interior side of the housing portion.
Public/Granted literature
- US20090091879A1 METHODS AND APPARATUS FOR PROVIDING HOLES THROUGH PORTIONS OF A HOUSING Public/Granted day:2009-04-09
Information query
