Invention Grant
- Patent Title: Method for fabricating robust light-emitting diodes
- Patent Title (中): 制造坚固的发光二极管的方法
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Application No.: US12160044Application Date: 2008-03-26
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Publication No.: US08222063B2Publication Date: 2012-07-17
- Inventor: Li Wang , Fengyi Jiang
- Applicant: Li Wang , Fengyi Jiang
- Applicant Address: CN Nanchang
- Assignee: Lattice Power (Jiangxi) Corporation
- Current Assignee: Lattice Power (Jiangxi) Corporation
- Current Assignee Address: CN Nanchang
- Agency: Park, Vaughan, Fleming & Dowler LLP
- Agent Shun Yao
- International Application: PCT/CN2008/000596 WO 20080326
- International Announcement: WO2009/117484 WO 20091001
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
One embodiment of the present invention provides a method for fabricating light-emitting diodes (LEDs). The method includes fabricating an InGaAlN-based multilayer LED structure on a conductive substrate. The method further includes etching grooves of a predetermined pattern through the active region of the multilayer LED structure. The grooves separate a light-emitting region from non-light-emitting regions. In addition, the method includes depositing electrode material on the light-emitting and non-light-emitting regions, thereby creating an electrode. Furthermore, the method includes depositing a passivation layer covering the light-emitting and non-light-emitting regions. Moreover, the method includes removing the passivation layer on the electrode to allow the non-light-emitting regions which are covered with the electrode material and the passivation layer to be higher than the light-emitting region and the electrode, thereby protecting the light-emitting region from contact with test equipment.
Public/Granted literature
- US20110049540A1 METHOD FOR FABRICATING ROBUST LIGHT-EMITTING DIODES Public/Granted day:2011-03-03
Information query
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