Invention Grant
- Patent Title: Semiconductor package adapted for high-speed data processing and damage prevention of chips packaged therein and method for fabricating the same
- Patent Title (中): 适用于封装在其中的芯片的高速数据处理和损坏防护的半导体封装及其制造方法
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Application No.: US12758973Application Date: 2010-04-13
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Publication No.: US08222083B2Publication Date: 2012-07-17
- Inventor: Seung Hyun Lee , Seung Taek Yang
- Applicant: Seung Hyun Lee , Seung Taek Yang
- Applicant Address: KR Kyoungki-do
- Assignee: Hynix Semiconductor Inc.
- Current Assignee: Hynix Semiconductor Inc.
- Current Assignee Address: KR Kyoungki-do
- Agency: Ladas & Parry LLP
- Priority: KR10-2007-0076007 20070727
- Main IPC: H01L21/304
- IPC: H01L21/304 ; H01L21/50
Abstract:
A semiconductor package includes a semiconductor chip provided with a first surface having a bonding pad, a second surface opposing to the first surface and side surfaces; a first redistribution pattern connected with the bonding pad and extending along the first surface from the bonding pad to an end portion of the side surface which meets with the second surface; and a second redistribution pattern disposed over the first redistribution pattern and extending from the side surfaces to the first surface. In an embodiment of the present invention, in which the first redistribution pattern connected with the bonding pad is formed over the semiconductor chip and the second redistribution pattern is formed over the first redistribution pattern, it is capable of reducing a length for signal transfer since the second redistribution pattern is used as an external connection terminal. It is also capable of processing data with high speed, as well as protecting the semiconductor chip having weak brittleness, since the semiconductor package is connected to the substrate without a separate solder ball.
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