Magnetic recording heads and associated fabrication methods are disclosed. A heat spreader structure in a magnetic recording head includes a seed layer with a heat spreader layer formed on the seed layer. When the heat spreader layer (e.g., Aluminum Nitride) is grown on the seed layer (e.g., NiTa or Alumina), the heat spreader layer forms a well-oriented crystalline structure that allows for a desired thermal conductivity, such as a thermal conductivity greater than about 55 W/m−K. As a result of using the seed layer, a material such as Aluminum Nitride can be used for a heat spreader layer to effectively dissipate heat in a magnetic recording head.