Invention Grant
- Patent Title: Acoustic wave element, duplexer, communication module, and communication apparatus
- Patent Title (中): 声波元件，双工器，通信模块和通信设备
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Application No.: US12712144Application Date: 2010-02-24
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Publication No.: US08222972B2Publication Date: 2012-07-17
- Inventor: Kazunori Inoue , Takashi Matsuda , Michio Miura , Suguru Warashina
- Applicant: Kazunori Inoue , Takashi Matsuda , Michio Miura , Suguru Warashina
- Applicant Address: JP Tokyo
- Assignee: Taiyo Yuden Co., Ltd.
- Current Assignee: Taiyo Yuden Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Chen Yoshimura LLP
- Main IPC: H03H9/46
- IPC: H03H9/46
Abstract:
An acoustic wave element includes: resonators 2 each including an electrode to excite acoustic waves; a power supply wiring portion 3 that is disposed so as to connect the resonators 2 electrically; a piezoelectric substrate 4 on which the resonators 2 and the power supply wiring portion 3 are formed; a second medium 5 that is formed on the piezoelectric substrate 4 so as to cover the resonators 2; and a third medium 6 that is formed on the piezoelectric substrate 4 so as to cover at least the second medium 5 and the power supply wiring portion 3. A side surface 34 of the power supply wiring portion 3 that is in contact with a surface of the piezoelectric substrate 4 forms an obtuse first angle θ with respect to the surface 4a of the piezoelectric substrate 4.
Public/Granted literature
- US20100148890A1 ACOUSTIC WAVE ELEMENT, DUPLEXER, COMMUNICATION MODULE, AND COMMUNICATION APPARATUS Public/Granted day:2010-06-17
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