发明授权
- 专利标题： Heat sink and cooling unit using the same
- 专利标题（中）： 散热器和冷却单元使用相同
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申请号： US11718272申请日： 2006-01-11
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公开(公告)号： US08225854B2公开(公告)日： 2012-07-24
- 发明人: Shigetoshi Ippoushi , Akira Yamada , Takeshi Tanaka , Akihiro Murahashi , Kazuyoshi Toya , Hideo Okayama
- 申请人： Shigetoshi Ippoushi , Akira Yamada , Takeshi Tanaka , Akihiro Murahashi , Kazuyoshi Toya , Hideo Okayama
- 申请人地址： JP Tokyo
- 专利权人： Mitsubishi Denki Kabushiki Kaisha
- 当前专利权人： Mitsubishi Denki Kabushiki Kaisha
- 当前专利权人地址： JP Tokyo
- 代理机构： Leydig, Voit & Mayer, Ltd.
- 优先权： JP2005-007975 20050114
- 国际申请： PCT/JP2006/300208 WO 20060111
- 国际公布： WO2006/075614 WO 20060720
- 主分类号： F28D7/06
- IPC分类号： F28D7/06 ; F28F7/00
摘要：
A heat sink including a compact cooling system, superior uniformity of heating, provides a compact cooling unit superior in uniformity of cooling. A heat sink includes a header for distribution connected to a cooling fluid inlet, a header for confluence connected to a cooling fluid outlet and parallel to and adjacent to the header for distribution and a heat transfer vessel including a heating element mounting surface as well as channels inside. The channels are connected to the header for distribution and the header for confluence.
公开/授权文献
- US20090080159A1 HEAT SINK AND COOLING UNIT USING THE SAME 公开/授权日：2009-03-26
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