Invention Grant
- Patent Title: Door coupling system
- Patent Title (中): 门联系统
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Application No.: US12328230Application Date: 2008-12-04
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Publication No.: US08226180B2Publication Date: 2012-07-24
- Inventor: Mahendra Madhukar Patil , Timothy Scott Shaffer , Derek Lee Watkins
- Applicant: Mahendra Madhukar Patil , Timothy Scott Shaffer , Derek Lee Watkins
- Applicant Address: US NY Schenectady
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Schenectady
- Agency: Global Patent Operation
- Agent Douglas D. Zhang
- Main IPC: A47B95/00
- IPC: A47B95/00 ; A47B88/00 ; E05C7/06 ; E05F17/00

Abstract:
An apparatus including a frame forming an internal cavity, the frame having an opening for accessing the internal cavity, a first door and a second door mounted to the frame and a door coupling mechanism for effecting a substantially simultaneous movement of the first door and second door relative to the frame, the door coupling mechanism including a first door link, a second door link and at least one ternary link, the first door link being rotatably coupled to the first door and the at least one ternary link, the second door being rotatably coupled to the second door and the at least one ternary link.
Public/Granted literature
- US20100139169A1 DOOR COUPLING SYSTEM Public/Granted day:2010-06-10
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