A method for manufacturing a flooring product with integrated circuitry, comprising the steps of providing a plurality of pieces (6), stacking said pieces on top of each other, displaced in relation to each other to form an offset stack (10), and compressing said offset stack to form said flooring product. The method further comprises arranging flexible circuitry (7) on an upper surface of at least one piece, so that, when said pieces are stacked, a first portion (7a) of flexible circuitry on the at least one piece is exposed, said first portion (7a) including circuitry for interacting with the environment. By arranging the circuitry in the flooring during such a manufacturing process, a flooring product is achieved where only a portion of the circuitry is exposed, and another portion is embedded in the flooring. This allows for exposing those parts of the circuitry that are adapted to interact with the surrounding environment, such as optical components, pressure sensitive components, acoustic components, etc.