Invention Grant
- Patent Title: High-hardness conductive diamond polycrystalline body and method of producing the same
- Patent Title (中): 高硬度导电金刚石多晶体及其制造方法
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Application No.: US10582330Application Date: 2004-12-03
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Publication No.: US08226922B2Publication Date: 2012-07-24
- Inventor: Hitoshi Sumiya
- Applicant: Hitoshi Sumiya
- Applicant Address: JP Osaka
- Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2003-412648 20031211
- International Application: PCT/JP2004/018011 WO 20041203
- International Announcement: WO2005/065809 WO 20050721
- Main IPC: C01B35/00
- IPC: C01B35/00 ; B01J3/06

Abstract:
A diamond sintered body conventionally used in a cutting tool or the like includes an iron group metal element as a sintering aid, and therefore has a problem in heat resistance. A diamond sintered body not including the iron group metal, on the other hand, does not have sufficient mechanical strength to be used as a tool material, and also does not have conductivity, which makes electrical discharge machining impossible, and thus processing thereof is difficult. A diamond polycrystalline body having high heat resistance and mechanical strength and having conductivity enabling electrical discharge machining is obtained by using only an amorphous or fine graphite-type carbon material as a starting material, adding boron thereto and concurrently performing conversion into diamond and sintering in an ultra-high pressure and temperature condition.
Public/Granted literature
- US20080022806A1 High-Hardness Conductive Diamond Polycrystalline Body and Method of Producing the Same Public/Granted day:2008-01-31
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