Invention Grant
US08227270B2 Method of making a semiconductor chip assembly with a post/base heat spreader and an adhesive between the base and a terminal
有权
制造具有后/底部散热器的半导体芯片组件和在基座与端子之间的粘合剂的方法
- Patent Title: Method of making a semiconductor chip assembly with a post/base heat spreader and an adhesive between the base and a terminal
- Patent Title (中): 制造具有后/底部散热器的半导体芯片组件和在基座与端子之间的粘合剂的方法
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Application No.: US12834013Application Date: 2010-07-12
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Publication No.: US08227270B2Publication Date: 2012-07-24
- Inventor: Charles W. C. Lin , Chia-Chung Wang
- Applicant: Charles W. C. Lin , Chia-Chung Wang
- Applicant Address: TW Taipei
- Assignee: Bridge Semiconductor Corporation
- Current Assignee: Bridge Semiconductor Corporation
- Current Assignee Address: TW Taipei
- Agency: Jackson IPG PLLC
- Main IPC: H01L21/50
- IPC: H01L21/50
Abstract:
A method of making a semiconductor chip assembly includes providing a thermal post, a signal post, a base and a terminal, mounting an adhesive on the base including inserting the thermal post into a first opening in the adhesive and the signal post into a second opening in the adhesive, mounting a conductive layer on the adhesive including aligning the thermal post with a first aperture in the conductive layer and the signal post with a second aperture in the conductive layer, then flowing the adhesive upward between the thermal post and the conductive layer and between the signal post and the conductive layer and downward between the base and the terminal, solidifying the adhesive, providing a conductive trace that includes a pad, the terminal and the signal post, wherein the pad includes a selected portion of the conductive layer, mounting a semiconductor device on a heat spreader that includes the thermal post and the base, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader.
Public/Granted literature
Information query
IPC分类:
