发明授权
- 专利标题: Semiconductor exposure device using extreme ultra violet radiation
- 专利标题(中): 半导体曝光装置采用极紫外辐射
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申请号: US12469176申请日: 2009-05-20
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公开(公告)号: US08227778B2公开(公告)日: 2012-07-24
- 发明人: Masato Moriya , Osamu Wakabayashi , Georg Soumagne
- 申请人: Masato Moriya , Osamu Wakabayashi , Georg Soumagne
- 申请人地址: JP Tokyo JP Tokyo
- 专利权人: Komatsu Ltd.,Gigaphoton, Inc.
- 当前专利权人: Komatsu Ltd.,Gigaphoton, Inc.
- 当前专利权人地址: JP Tokyo JP Tokyo
- 代理机构: McDermott Will & Emery LLP
- 优先权: JP2008-132479 20080520; JP2008-226548 20080904
- 主分类号: G21K5/04
- IPC分类号: G21K5/04
摘要:
The exposure device is able to supply only EUV radiation to a mask, while eliminating radiation other than the EUV radiation. A multi layer made from a plurality of Mo/Si pair layers is provided upon the front surface of a mirror, and blazed grooves are formed in this multi layer. Radiation which is incident from a light source device is incident upon this mirror, and is reflected or diffracted. Since the reflected EUV radiation (including diffracted EUV radiation) and the radiation of other wavelengths are reflected or diffracted at different angles, accordingly their directions of progression are different. By eliminating the radiation of other wavelengths with an aperture and/or a dumper, it is possible to irradiate a mask only with EUV radiation of high purity.
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