Invention Grant
- Patent Title: Stepwise capacitor structure and substrate employing the same
- Patent Title (中): 逐步电容器结构和使用它的衬底
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Application No.: US12410466Application Date: 2009-03-25
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Publication No.: US08227894B2Publication Date: 2012-07-24
- Inventor: Min-Lin Lee , Shih-Hsien Wu , Shinn-Juh Lai , Shur-Fen Liu
- Applicant: Min-Lin Lee , Shih-Hsien Wu , Shinn-Juh Lai , Shur-Fen Liu
- Applicant Address: TW Hsinchu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu
- Agency: Jianq Chyun IP Office
- Priority: TW96144117A 20071121; TW97144950A 20081120
- Main IPC: H01L29/423
- IPC: H01L29/423

Abstract:
A stepwise capacitor structure includes at least one stepwise conductive layer. The stepwise capacitor represents a feature of multiple capacitors. When currents flow through the stepwise capacitor, different current paths are presented in between an upper conductor and a bottom conductor of the stepwise capacitor in response to different current frequency; different inductor is induced in each path and decoupled by a stepwise capacitor structure as disclosed herein.
Public/Granted literature
- US20090180236A1 STEPWISE CAPACITOR STRUCTURE, FABRICATION METHOD THEREOF AND SUBSTRATE EMPLOYING THE SAME Public/Granted day:2009-07-16
Information query
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