发明授权
- 专利标题： Alignment for backside illumination sensor
- 专利标题（中）： 背面照明传感器对准
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申请号： US12553586申请日： 2009-09-03
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公开(公告)号： US08227899B2公开(公告)日： 2012-07-24
- 发明人: Jen-Cheng Liu , Dun-Nian Yaung , Shou-Gwo Wuu
- 申请人： Jen-Cheng Liu , Dun-Nian Yaung , Shou-Gwo Wuu
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Haynes and Boone, LLP
- 主分类号： H01L23/544
- IPC分类号： H01L23/544
摘要：
Provided is an apparatus that includes an integrated circuit located in a first region of a substrate having first and second opposing major surfaces and an alignment mark located in a second region of the substrate and extending through the substrate between the first and second surfaces.
公开/授权文献
- US20090321888A1 ALIGNMENT FOR BACKSIDE ILLUMINATION SENSOR 公开/授权日：2009-12-31