发明授权
- 专利标题： Integrated circuit packaging system with interposer
- 专利标题（中）： 内置式集成电路封装系统
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申请号： US13397562申请日： 2012-02-15
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公开(公告)号： US08227925B2公开(公告)日： 2012-07-24
- 发明人: Sungmin Song , SeongMin Lee , WonJun Ko
- 申请人： Sungmin Song , SeongMin Lee , WonJun Ko
- 申请人地址： SG Singapore
- 专利权人： Stats Chippac Ltd.
- 当前专利权人： Stats Chippac Ltd.
- 当前专利权人地址： SG Singapore
- 代理机构： Ishimaru & Associates LLP
- 代理商 Mikio Ishimaru; Stanley Chang
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L23/52 ; H01L29/40
摘要：
An integrated circuit packaging system comprising: a base package substrate; a first integrated circuit die attached over the base package substrate; and an interposer having a recessed edge and a corner that extends to a singulation edge, the interposer mounted over the first integrated circuit die, the interposer having a recess gap between the recessed edge and the singulation edge.
公开/授权文献
- US20120146243A1 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER 公开/授权日：2012-06-14
信息查询
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