Invention Grant
- Patent Title: Assembly of electromagnetic relay and circuit board
- Patent Title (中): 电磁继电器和电路板组装
-
Application No.: US12588955Application Date: 2009-11-03
-
Publication No.: US08228143B2Publication Date: 2012-07-24
- Inventor: Satoshi Takano
- Applicant: Satoshi Takano
- Applicant Address: JP Tokyo
- Assignee: Fujitsu Component Limited
- Current Assignee: Fujitsu Component Limited
- Current Assignee Address: JP Tokyo
- Agency: Staas & Halsey LLP
- Priority: JP2008-283336 20081104
- Main IPC: H01H51/22
- IPC: H01H51/22

Abstract:
An assembly including an electromagnetic relay and a circuit board. The electromagnetic relay includes a body having a lateral surface and a bottom surface, and a plurality of terminals protruding outward from the lateral surface of the body. The terminals respectively have distal portions extending beyond the bottom surface of the body. The circuit board is provided with a relay-mount surface. The electromagnetic relay is mounted on the relay-mount surface in an orientation such that the bottom surface of the body is opposed to the relay-mount surface, and the distal portions of the terminals being fixed to the circuit board. Each terminal is formed from a flat plate element and has a shape angled in a width direction of the flat plate element. The body has a height defined in a direction orthogonal to the relay-mount surface of the circuit board and corresponding to a length of a shortest edge of the lateral surface, the shortest edge being shorter than any of edges of the bottom surface.
Public/Granted literature
- US20100109821A1 Assembly of electromagnetic relay and circuit board Public/Granted day:2010-05-06
Information query