Invention Grant
- Patent Title: Method of fabricating an acoustic resonator comprising a filled recessed region
- Patent Title (中): 制造包括填充凹陷区域的声谐振器的方法
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Application No.: US11938078Application Date: 2007-11-09
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Publication No.: US08230562B2Publication Date: 2012-07-31
- Inventor: Ronald S. Fazzio , Richard C. Ruby
- Applicant: Ronald S. Fazzio , Richard C. Ruby
- Applicant Address: SG Singapore
- Assignee: Avago Technologies Wireless IP (Singapore) Pte. Ltd.
- Current Assignee: Avago Technologies Wireless IP (Singapore) Pte. Ltd.
- Current Assignee Address: SG Singapore
- Main IPC: H04R17/10
- IPC: H04R17/10 ; B05D1/32
Abstract:
A method for fabricating an acoustic resonator comprises providing a substrate; fabricating a first electrode adjacent the substrate; fabricating a piezoelectric layer adjacent the first electrode; depositing electrode material to form a second electrode up to a first thickness adjacent the piezoelectric layer; depositing a first photo mask over the second electrode; depositing additional electrode material to form the second electrode up to a second thickness; removing the photo mask thereby forming a recessed region in the second electrode; and filling the recessed region with a fill material.
Public/Granted literature
- US20080060181A1 ACOUSTIC RESONATOR PERFORMANCE ENHANCEMENT USING FILLED RECESS REGION Public/Granted day:2008-03-13
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