Invention Grant
- Patent Title: Method of cooling a resistor
- Patent Title (中): 冷却电阻的方法
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Application No.: US11848263Application Date: 2007-08-31
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Publication No.: US08230586B2Publication Date: 2012-07-31
- Inventor: Douglas D Coolbaugh , Ebenezer E Eshun , Terence B Hook , Robert M Rassel , Edmund J Sprogis , Anthony K Stamper , William J Murphy
- Applicant: Douglas D Coolbaugh , Ebenezer E Eshun , Terence B Hook , Robert M Rassel , Edmund J Sprogis , Anthony K Stamper , William J Murphy
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Roberts Mlotkowski Safran & Cole, P.C.
- Agent Anthony Canale
- Main IPC: H01C7/02
- IPC: H01C7/02 ; H01C7/04
Abstract:
A method of cooling a resistor is provided. The method includes forming a first electrical insulator having a high thermal conductivity in thermal contact with an electrically resistive pathway and forming a substrate adjacent the electrical insulator. The method further includes forming a first electrical conductor having a high thermal conductivity within the second substrate and in thermal contact with the electrical insulator.
Public/Granted literature
- US20080042798A1 HEAT SINK FOR INTEGRATED CIRCUIT DEVICES Public/Granted day:2008-02-21
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