Invention Grant
- Patent Title: Percolation efficiency of the conductivity of electrically conductive adhesives
- Patent Title (中): 导电胶的导电性渗透效率
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Application No.: US12453810Application Date: 2009-05-22
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Publication No.: US08231808B2Publication Date: 2012-07-31
- Inventor: Cheng Yang , Matthew Ming Fai Yuen , Bing Xu
- Applicant: Cheng Yang , Matthew Ming Fai Yuen , Bing Xu
- Applicant Address: CN Hong Kong
- Assignee: Hong Kong University of Science and Technology
- Current Assignee: Hong Kong University of Science and Technology
- Current Assignee Address: CN Hong Kong
- Agency: The Nath Law Group
- Agent Jerald L. Meyer; Stanley N. Protigal
- Main IPC: H01B1/00
- IPC: H01B1/00 ; H01B1/02 ; H01B1/22 ; B32B5/16 ; B32B9/00
Abstract:
An electroconductive bonding material is formed as a Modified Electrically Conductive Adhesive (MECA), and consists of a resin matrix and a modified conductive filler. The resin matrix if formed by providing a thermosetting or thermoplastic resin-based polymer resin. The conductive filler is a metal filler material suitable for use as conductive filler for the resin matrix. The metal filler is modified by applying a material selected from one of halogens, pseudohalogens or their precursors.
Public/Granted literature
- US20090294734A1 Percolation Efficiency of the conductivity of electrically conductive adhesives Public/Granted day:2009-12-03
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