发明授权
US08232185B2 Method for manufacturing semiconductor chip, adhesive film for semiconductor, and composite sheet using the film
失效
半导体芯片的制造方法，半导体用粘合膜以及使用该膜的复合片
- 专利标题： Method for manufacturing semiconductor chip, adhesive film for semiconductor, and composite sheet using the film
- 专利标题（中）： 半导体芯片的制造方法，半导体用粘合膜以及使用该膜的复合片
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申请号： US12594634申请日： 2008-03-31
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公开(公告)号： US08232185B2公开(公告)日： 2012-07-31
- 发明人: Yuuki Nakamura , Tsutomu Kitakatsu , Youji Katayama , Keiichi Hatakeyama
- 申请人： Yuuki Nakamura , Tsutomu Kitakatsu , Youji Katayama , Keiichi Hatakeyama
- 申请人地址： JP Tokyo
- 专利权人： Hitachi Chemical Company, Ltd.
- 当前专利权人： Hitachi Chemical Company, Ltd.
- 当前专利权人地址： JP Tokyo
- 代理机构： Antonelli, Terry, Stout & Kraus, LLP.
- 优先权： JPP2007-099344 20070405; JPP2007-204338 20070806
- 国际申请： PCT/JP2008/056361 WO 20080331
- 国际公布： WO2008/126718 WO 20081023
- 主分类号： H01L21/44
- IPC分类号： H01L21/44 ; H01L21/48 ; H01L21/50 ; H01L21/46 ; H01L21/78
摘要：
There is provided a method that allows semiconductor chips to be obtained from a semiconductor wafer at high yield, while sufficiently inhibiting generation of chip cracks and burrs. The method for manufacturing a semiconductor chip comprises a step of preparing a laminated body having a semiconductor wafer, an adhesive film for a semiconductor and dicing tape laminated in that order, the semiconductor wafer being partitioned into multiple semiconductor chips and notches being formed from the semiconductor wafer side so that at least a portion of the adhesive film for a semiconductor remains uncut in its thickness direction, and a step of stretching out the dicing tape in a direction so that the multiple semiconductor chips are separated apart, to separate the adhesive film for a semiconductor along the notches. The adhesive film for a semiconductor has a tensile breaking elongation of less than 5% and the tensile breaking elongation of less than 110% of the elongation at maximum load.
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