Invention Grant
- Patent Title: Interconnect pattern for high performance interfaces
- Patent Title (中): 互连模式用于高性能接口
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Application No.: US12702823Application Date: 2010-02-09
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Publication No.: US08232480B2Publication Date: 2012-07-31
- Inventor: Hui Liu
- Applicant: Hui Liu
- Applicant Address: US CA San Jose
- Assignee: Altera Corporation
- Current Assignee: Altera Corporation
- Current Assignee Address: US CA San Jose
- Agency: Ward & Zinna, LLC
- Main IPC: H05K1/11
- IPC: H05K1/11

Abstract:
In one embodiment, differential signaling and ground contacts are located in a rectilinear array of rows and columns with ground contacts spaced apart by three times the pitch distance between adjacent rows or columns and signaling contacts are located immediately adjacent the ground contacts. In particular, the two contacts of each differential pair are located one pitch distance apart from each other and one contact of each differential pair of contacts is located one pitch distance from a ground contact and the other contact of the differential pair is located approximately sqrt(2)*pitch distance from the same ground contact. In a second embodiment, differential signaling and ground contacts are located in a hexagonal array with ground contacts located three times the pitch distance between adjacent contacts and signaling contacts located immediately adjacent the ground contacts. In particular, the two contacts of each differential pair are located one pitch distance apart from each other and both contacts of each differential pair of contacts are located one pitch distance from a ground contact.
Public/Granted literature
- US20110192640A1 INTERCONNECT PATTERN FOR HIGH PERFORMANCE INTERFACES Public/Granted day:2011-08-11
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