Invention Grant
- Patent Title: Electronic module with center mounting fasteners
- Patent Title (中): 带中心安装紧固件的电子模块
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Application No.: US12724040Application Date: 2010-03-15
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Publication No.: US08233280B2Publication Date: 2012-07-31
- Inventor: George Koprivnak , Robert Dodge , Jeremie Buday , David Perrin , Russ Myers
- Applicant: George Koprivnak , Robert Dodge , Jeremie Buday , David Perrin , Russ Myers
- Applicant Address: US CA City of Industry
- Assignee: Lincoln Global, Inc.
- Current Assignee: Lincoln Global, Inc.
- Current Assignee Address: US CA City of Industry
- Agency: Hahn Loeser & Parks LLP
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
An electronic module is employed with at least one interiorly positioned fastener that at least partially secures a central region of the electronic module to an object to prevent bowing or warping. The module contains a base, at least two peripheral fasteners at opposed ends of the module, and the at least one interiorly positioned fastener, wherein the base is capable of accepting electronic components and further includes at least one layer, and wherein the at least one interiorly positioned fastener is interposed between the at least two peripheral fasteners.
Public/Granted literature
- US20110222245A1 ELECTRONIC MODULE WITH CENTER MOUNTING FASTENERS Public/Granted day:2011-09-15
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