Invention Grant
US08234999B2 Device for the application of adhesive and machine and method for manufacturing paper cups
失效
用于粘合剂和机器的应用的装置以及用于制造纸杯的方法
- Patent Title: Device for the application of adhesive and machine and method for manufacturing paper cups
- Patent Title (中): 用于粘合剂和机器的应用的装置以及用于制造纸杯的方法
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Application No.: US12653473Application Date: 2009-12-15
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Publication No.: US08234999B2Publication Date: 2012-08-07
- Inventor: Uwe Messerschmid
- Applicant: Uwe Messerschmid
- Applicant Address: DE Donzdorf
- Assignee: Michael Hoerauf Maschinenfabrik GmbH & Co. KG
- Current Assignee: Michael Hoerauf Maschinenfabrik GmbH & Co. KG
- Current Assignee Address: DE Donzdorf
- Agency: Flynn, Thiel, Boutell & Tanis, P.C.
- Priority: DE102008064502 20081222; DE102009055986 20091120
- Main IPC: B05C5/02
- IPC: B05C5/02
Abstract:
A device for the application of adhesive and machine and method for manufacturing paper cups. The device applies adhesive, particularly for the manufacture of a paper cup from at least one paper segment, and includes a stamp for the application of the adhesive. The stamp is made of a compression-resistant porous sintered material.
Public/Granted literature
- US20100154983A1 Device for the application of adhesive and machine and method for manufacturing paper cups Public/Granted day:2010-06-24
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