发明授权
US08236619B2 Method of making a semiconductor chip assembly with a post/base heat spreader and a mulitlevel conductive trace
有权
制造具有柱/基散热器的半导体芯片组件和多种导电迹线的方法
- 专利标题： Method of making a semiconductor chip assembly with a post/base heat spreader and a mulitlevel conductive trace
- 专利标题（中）： 制造具有柱/基散热器的半导体芯片组件和多种导电迹线的方法
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申请号： US13092913申请日： 2011-04-23
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公开(公告)号： US08236619B2公开(公告)日： 2012-08-07
- 发明人: Charles W. C. Lin , Chia-Chung Wang
- 申请人： Charles W. C. Lin , Chia-Chung Wang
- 申请人地址： TW Taipei
- 专利权人： Bridge Semiconductor Corporation
- 当前专利权人： Bridge Semiconductor Corporation
- 当前专利权人地址： TW Taipei
- 代理机构： Jackson IPG PLLC
- 主分类号： H01L21/00
- IPC分类号： H01L21/00
摘要：
A method of making a semiconductor chip assembly includes providing a post and a base, mounting a second adhesive on the base, mounting a substrate with a conductive pattern on the second adhesive, mounting a first adhesive on the substrate and mounting a conductive layer on the first adhesive, then flowing the first adhesive upward between the post and the conductive layer and flowing the second adhesive upward between the post and the substrate, solidifying the adhesives, then providing a conductive trace that includes a pad, a terminal, the conductive pattern, first and second vias and a selected portion of the conductive layer, mounting a semiconductor device on the post, wherein a heat spreader includes the post and the base, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader.
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