发明授权
US08236906B2 Polyamide-imide resin, process for production of polyamide resin, and curable resin composition
有权
聚酰胺酰亚胺树脂,聚酰胺树脂的制造方法和固化性树脂组合物
- 专利标题: Polyamide-imide resin, process for production of polyamide resin, and curable resin composition
- 专利标题(中): 聚酰胺酰亚胺树脂,聚酰胺树脂的制造方法和固化性树脂组合物
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申请号: US12293648申请日: 2007-03-20
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公开(公告)号: US08236906B2公开(公告)日: 2012-08-07
- 发明人: Takako Ejiri , Katsuyuki Masuda
- 申请人: Takako Ejiri , Katsuyuki Masuda
- 申请人地址: JP Tokyo
- 专利权人: Hitachi Chemical Company, Ltd.
- 当前专利权人: Hitachi Chemical Company, Ltd.
- 当前专利权人地址: JP Tokyo
- 代理机构: Antonelli, Terry, Stout & Kraus, LLP.
- 优先权: JPP2006-078692 20060322; JPP2006-109694 20060412; JPP2006-318852 20061127; JPP2006-318928 20061127
- 国际申请: PCT/JP2007/055684 WO 20070320
- 国际公布: WO2007/108472 WO 20070927
- 主分类号: C08F283/04
- IPC分类号: C08F283/04
摘要:
A process for production of a polyamide resin having a reactive double bond, the process including a step of reacting a carboxylic acid and a diisocyanate to produce a polyamide resin, wherein the carboxylic acid component includes a carboxylic acid with a reactive double bond. Also, a polyamideimide resin obtainable by reacting a diisocyanate with a diimidedicarboxylic acid and a reactive double bond-containing carboxylic acid, which has a reactive double bond.
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