Invention Grant
- Patent Title: ESD protection device
- Patent Title (中): ESD保护装置
-
Application No.: US12846878Application Date: 2010-07-30
-
Publication No.: US08238069B2Publication Date: 2012-08-07
- Inventor: Jun Adachi , Jun Urakawa , Takahiro Sumi , Takahiro Kitazume
- Applicant: Jun Adachi , Jun Urakawa , Takahiro Sumi , Takahiro Kitazume
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2008-025392 20080205; JP2008-314771 20081210
- Main IPC: H02H1/00
- IPC: H02H1/00

Abstract:
An ESD protection device has a structure that allows ESD characteristics to be easily adjusted and stabilized. The ESD protection device includes a ceramic multilayer substrate, at least a pair of discharge electrodes located in the ceramic multilayer substrate and facing each other with a space disposed therebetween, and external electrodes located on a surface of the ceramic multilayer substrate and connected to the discharge electrodes. The ESD protection device includes a supporting electrode disposed in a region that connects the pair of discharge electrodes. The supporting electrode is made of a conductive material coated with an inorganic material having no conductivity.
Public/Granted literature
- US20100309595A1 ESD PROTECTION DEVICE Public/Granted day:2010-12-09
Information query