Invention Grant
US08240218B2 Stress sensing devices and methods 有权
应力传感装置和方法

Stress sensing devices and methods
Abstract:
Embodiments relate to stress sensing devices and methods. In an embodiment, a sensor device includes an active layer; and at least three contacts spaced apart from one another in the active layer, the at least three contacts being coupleable in a first configuration for a first operating mode of the sensor device in which a current in the active layer has a first ratio of horizontal to vertical components with respect to a die surface and in a second configuration different from the first for a second operating mode of the sensor device in which a current in the active layer has a second ratio of horizontal to vertical components, wherein a ratio of a resistance between at least two of the contacts in the first operating mode and a resistance between at least two of the contacts in the second operating mode is related to mechanical stress in the sensor device.
Public/Granted literature
Information query
Patent Agency Ranking
0/0