Invention Grant
- Patent Title: Multilayer substrate
- Patent Title (中): 多层基板
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Application No.: US12606265Application Date: 2009-10-27
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Publication No.: US08241757B2Publication Date: 2012-08-14
- Inventor: Chao-Tsang Wei , Chung-Pei Wang , Chien-Hao Huang , Wei-Cheng Ling , Chia-Ying Wu , Ga-Lane Chen
- Applicant: Chao-Tsang Wei , Chung-Pei Wang , Chien-Hao Huang , Wei-Cheng Ling , Chia-Ying Wu , Ga-Lane Chen
- Applicant Address: TW Tu-Cheng, New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW Tu-Cheng, New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN200810306318 20081217
- Main IPC: B32B15/04
- IPC: B32B15/04 ; B32B9/04 ; B32B17/06
Abstract:
A multilayer substrate includes a base layer, a coating layer and an intermediate layer positioned between the base layer and the coating layer. The intermediate layer contains chromium and nitrogen. A content of the chromium in the intermediate layer gradually decreases from the base layer to the coating layer.
Public/Granted literature
- US20100151271A1 MULTILAYER SUBSTRATE Public/Granted day:2010-06-17
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