Invention Grant
US08242216B2 Low coefficient of thermal expansion (CTE) thermosetting resins for integrated circuit applications
有权
用于集成电路应用的低热膨胀系数（CTE）热固性树脂
- Patent Title: Low coefficient of thermal expansion (CTE) thermosetting resins for integrated circuit applications
- Patent Title (中): 用于集成电路应用的低热膨胀系数（CTE）热固性树脂
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Application No.: US13169784Application Date: 2011-06-27
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Publication No.: US08242216B2Publication Date: 2012-08-14
- Inventor: James C. Matayabas, Jr. , Tian-An Chen
- Applicant: James C. Matayabas, Jr. , Tian-An Chen
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: C08L63/00
- IPC: C08L63/00
Abstract:
An embodiment of the present invention is a technique to form a resin. A mixture is formed by a curing agent dissolved in the epoxy resin. The epoxy resin contains a first rigid rod mesogen. The curing agent contains a second rigid rod mesogen and one of a hydroxyl, amine, and anhydride.
Public/Granted literature
- US20110250458A1 LOW COEFFICIENT OF THERMAL EXPANSION (CTE) THERMOSETTING RESINS FOR INTEGRATED CIRCUIT APPLICATIONS Public/Granted day:2011-10-13
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