Invention Grant
- Patent Title: Printed circuit board having electromagnetic bandgap structure
- Patent Title (中): 具有电磁带隙结构的印刷电路板
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Application No.: US12654361Application Date: 2009-12-17
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Publication No.: US08242377B2Publication Date: 2012-08-14
- Inventor: Hyo-Jic Jung , Han Kim , Mi-Ja Han , Kang-Wook Bong , Dae-Hyun Park
- Applicant: Hyo-Jic Jung , Han Kim , Mi-Ja Han , Kang-Wook Bong , Dae-Hyun Park
- Applicant Address: KR Suwon
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon
- Priority: KR10-2009-0090166 20090923
- Main IPC: H05K9/00
- IPC: H05K9/00 ; H05K1/11

Abstract:
Disclosed is a printed circuit board into which an electromagnetic bandgap structure for blocking a noise is inserted. The electromagnetic bandgap structure can include a first conductor and a second conductor arranged on different planar surfaces, a third conductor arranged on a same planar surface that is different from a planar surface where the second conductor is arranged, and a first stitching via unit configured to connect the first conductor to the third connector through the planar surface where the second conductor is arranged and being electrically separated from the second conductor. The first conductor can include a first plate, a second plate spaced from the first plate, and a second stitching unit configured to electrically connect the first plate to the second plate through a planar surface that is different from a planar surface where the first plate and the second plate are arranged.
Public/Granted literature
- US20110067914A1 Printed circuit board having electromagnetic bandgap structure Public/Granted day:2011-03-24
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