发明授权
- 专利标题: Printed circuit board having electromagnetic bandgap structure
- 专利标题(中): 具有电磁带隙结构的印刷电路板
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申请号: US12654361申请日: 2009-12-17
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公开(公告)号: US08242377B2公开(公告)日: 2012-08-14
- 发明人: Hyo-Jic Jung , Han Kim , Mi-Ja Han , Kang-Wook Bong , Dae-Hyun Park
- 申请人: Hyo-Jic Jung , Han Kim , Mi-Ja Han , Kang-Wook Bong , Dae-Hyun Park
- 申请人地址: KR Suwon
- 专利权人: Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人: Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人地址: KR Suwon
- 优先权: KR10-2009-0090166 20090923
- 主分类号: H05K9/00
- IPC分类号: H05K9/00 ; H05K1/11
摘要:
Disclosed is a printed circuit board into which an electromagnetic bandgap structure for blocking a noise is inserted. The electromagnetic bandgap structure can include a first conductor and a second conductor arranged on different planar surfaces, a third conductor arranged on a same planar surface that is different from a planar surface where the second conductor is arranged, and a first stitching via unit configured to connect the first conductor to the third connector through the planar surface where the second conductor is arranged and being electrically separated from the second conductor. The first conductor can include a first plate, a second plate spaced from the first plate, and a second stitching unit configured to electrically connect the first plate to the second plate through a planar surface that is different from a planar surface where the first plate and the second plate are arranged.
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