Invention Grant
- Patent Title: Electronic component with diffusion barrier layer
- Patent Title (中): 具有扩散阻挡层的电子部件
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Application No.: US12448295Application Date: 2008-01-09
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Publication No.: US08242599B2Publication Date: 2012-08-14
- Inventor: Richard Fix , Oliver Wolst , Alexander Martin
- Applicant: Richard Fix , Oliver Wolst , Alexander Martin
- Applicant Address: DE Stuttgart
- Assignee: Robert Bosch GmbH
- Current Assignee: Robert Bosch GmbH
- Current Assignee Address: DE Stuttgart
- Agency: Kenyon & Kenyon LLP
- Priority: DE102007003541 20070124
- International Application: PCT/EP2008/050199 WO 20080109
- International Announcement: WO2008/090023 WO 20080731
- Main IPC: H01L23/532
- IPC: H01L23/532
Abstract:
An electronic component is described that includes a metallic layer on a substrate that is made of a semiconductor material and a diffusion barrier layer that is made of a material that has a small diffusion coefficient for the metal of the metallic layer which is formed between the metallic layer and the substrate.
Public/Granted literature
- US20100072621A1 ELECTRONIC COMPONENT Public/Granted day:2010-03-25
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