Disclosed is a printed circuit board structure which is manufactured by providing a core board, forming an inner circuit layer on the core board surface, forming a bonding pad on the inner circuit, forming a ring-shaped anti-etching layer on the bonding pad, forming an anti-soldering insulation layer on the ring-shaped anti-etching layer and the bonding pad, and forming an opening to expose a part of the bonding pad, wherein the radius of the opening is shorter than the radius of the ring-shaped anti-etching layer, and the bonding pad surface is free of concave. The described structure may prevent the solder extending along the bottom void of the anti-soldering insulation layer to other regions.