发明授权
- 专利标题： Printed circuit board
- 专利标题（中）： 印刷电路板
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申请号： US12872652申请日： 2010-08-31
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公开(公告)号： US08243466B2公开(公告)日： 2012-08-14
- 发明人: Shi-Piao Luo , Chia-Nan Pai , Shou-Kuo Hsu
- 申请人： Shi-Piao Luo , Chia-Nan Pai , Shou-Kuo Hsu
- 申请人地址： CN Shenzhen, Guangdong Province TW Tu-Cheng, New Taipei
- 专利权人： Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- 当前专利权人： Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- 当前专利权人地址： CN Shenzhen, Guangdong Province TW Tu-Cheng, New Taipei
- 代理机构： Altis Law Group, Inc.
- 优先权： CN201010242441 20100802
- 主分类号： H05K7/00
- IPC分类号： H05K7/00
摘要：
A printed circuit board includes first and second layers, a control chip, bonding pads, and several electronic elements. The bonding pads can be selectively applied to interconnect the first and second layers, and the control chip with any of the electronic elements in a simple layout.
公开/授权文献
- US20120026707A1 PRINTED CIRCUIT BOARD 公开/授权日：2012-02-02
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