Invention Grant
US08246147B2 Inkjet printhead substrate, method for manufacturing inkjet printhead substrate, inkjet print head, and inkjet recording apparatus
有权
喷墨打印头基板,喷墨打印头基板的制造方法,喷墨打印头和喷墨记录装置
- Patent Title: Inkjet printhead substrate, method for manufacturing inkjet printhead substrate, inkjet print head, and inkjet recording apparatus
- Patent Title (中): 喷墨打印头基板,喷墨打印头基板的制造方法,喷墨打印头和喷墨记录装置
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Application No.: US12484649Application Date: 2009-06-15
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Publication No.: US08246147B2Publication Date: 2012-08-21
- Inventor: Hideo Tamura , Yoshiyuki Imanaka , Koichi Omata , Takaaki Yamaguchi , Kousuke Kubo , Yuuji Tamaru , Ryoji Oohashi , Toshio Negishi , Kazuaki Shibata
- Applicant: Hideo Tamura , Yoshiyuki Imanaka , Koichi Omata , Takaaki Yamaguchi , Kousuke Kubo , Yuuji Tamaru , Ryoji Oohashi , Toshio Negishi , Kazuaki Shibata
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Canon USA Inc IP Division
- Priority: JP2008-156635 20080616; JP2009-030896 20090213
- Main IPC: B41J2/14
- IPC: B41J2/14 ; B41J2/16

Abstract:
An inkjet printhead substrate includes: a heat generating element configured to generate energy for ejecting ink; an electric wire electrically connecting the heat generating element and an electrode lead provided on a flexible film wiring substrate; a protecting film configured to protect the electric wire; an electrode pad to which the electrode lead is connected, the electrode pad being formed by providing an opening in the protecting film at a position above the electric wire; a region to which a sealing resin configured to protect an electrically connected portion of the electrode pad and the electrode lead is to be applied; and an ink-detecting electrode composed of a metal wire and formed at the region to which the sealing resin is to be applied. The metal wire has a smaller width than an opening provided in the protecting film from which the metal wire is exposed.
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