发明授权
US08247138B2 Metal fluid distribution plate with an adhesion promoting layer and polymeric layer
有权
金属流体分布板,具有粘附促进层和聚合物层
- 专利标题: Metal fluid distribution plate with an adhesion promoting layer and polymeric layer
- 专利标题(中): 金属流体分布板,具有粘附促进层和聚合物层
-
申请号: US13222162申请日: 2011-08-31
-
公开(公告)号: US08247138B2公开(公告)日: 2012-08-21
- 发明人: Mahmoud H. Abd Elhamid , Feng Zhong , Richard H. Blunk
- 申请人: Mahmoud H. Abd Elhamid , Feng Zhong , Richard H. Blunk
- 申请人地址: US MI Detroit
- 专利权人: GM Global Technology Operations LLC
- 当前专利权人: GM Global Technology Operations LLC
- 当前专利权人地址: US MI Detroit
- 代理机构: Brooks Kushman P.C.
- 主分类号: H01M4/86
- IPC分类号: H01M4/86
摘要:
In at least one embodiment, the present invention provides an electrically conductive fluid distribution plate and a method of making, and system for using, the electrically conductive fluid distribution plate. In at least one embodiment, the plate comprises an electrically conductive fluid distribution plate comprising a metallic plate body defining a set of fluid flow channels configured to distribute flow of a fluid across at least one side of the plate, a metal-containing adhesion promoting layer having a thickness less than 100 nm disposed on the plate body, and a composite polymeric conductive layer disposed on the metal-containing adhesion promoting layer.
公开/授权文献
信息查询