发明授权
- 专利标题： Formation of alpha particle shields in chip packaging
- 专利标题（中）： 在芯片封装中形成α粒子屏蔽
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申请号： US12200352申请日： 2008-08-28
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公开(公告)号： US08247271B2公开(公告)日： 2012-08-21
- 发明人: Paul Stephen Andry , Cyril Cabral, Jr. , Kenneth P. Rodbell , Robert L. Wisnieff
- 申请人： Paul Stephen Andry , Cyril Cabral, Jr. , Kenneth P. Rodbell , Robert L. Wisnieff
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理机构： Schmeiser, Olsen & Watts
- 代理商 Louis J. Percello
- 主分类号： H01L21/30
- IPC分类号： H01L21/30
摘要：
A structure fabrication method. First, an integrated circuit including N chip electric pads is provided electrically connected to a plurality of devices on the integrated circuit. Then, an interposing shield having a top side and a bottom side and having N electric conductors in the interposing shield is provided being exposed to a surrounding ambient at the top side but not at the bottom side. Next, the integrated circuit is bonded to the top side of the interposing shield such that the N chip electric pads are in electrical contact with the N electric conductors. Next, the bottom side of the interposing shield is polished so as to expose the N electric conductors to the surrounding ambient at the bottom side of the interposing shield. Then, N solder bumps are formed on the polished bottom side of the interposing shield and in electrical contact with the N electric conductors.
公开/授权文献
- US20080318365A1 FORMATION OF ALPHA PARTICLE SHIELDS IN CHIP PACKAGING 公开/授权日：2008-12-25
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