发明授权
US08248116B2 Method of driving reverse conducting semiconductor device, semiconductor device and power supply device
失效
驱动反向导通半导体器件,半导体器件和电源器件的方法
- 专利标题: Method of driving reverse conducting semiconductor device, semiconductor device and power supply device
- 专利标题(中): 驱动反向导通半导体器件,半导体器件和电源器件的方法
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申请号: US12867591申请日: 2009-02-14
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公开(公告)号: US08248116B2公开(公告)日: 2012-08-21
- 发明人: Akitaka Soeno , Jun Saito
- 申请人: Akitaka Soeno , Jun Saito
- 申请人地址: JP Toyota-shi
- 专利权人: Toyota Jidosha Kabushiki Kaisha
- 当前专利权人: Toyota Jidosha Kabushiki Kaisha
- 当前专利权人地址: JP Toyota-shi
- 代理机构: Kenyon & Kenyon LLP
- 优先权: JP2008-033003 20080214
- 国际申请: PCT/JP2009/051690 WO 20090214
- 国际公布: WO2009/101868 WO 20090820
- 主分类号: H03K3/00
- IPC分类号: H03K3/00
摘要:
A technique for a reverse conducting semiconductor device including an IGBT element domain and a diode element domain that utilize body regions having a mutual impurity concentration, that makes it possible to adjust an injection efficiency of holes or electrons to the diode element domain, is provided. When a return current flows in the reverse conducting semiconductor device that uses an NPNP-type IGBT, a second voltage that is higher than a voltage of an emitter electrode is applied to second trench gate electrodes of the diode element domain. N-type inversion layers are formed in the periphery of the second trench gate electrodes, and the electrons flow therethrough via a first body contact region and a drift region which are of the same n-type. The injection efficiency of the electrons to the return current is increased, and the injection efficiency of the holes is decreased. Due to this, an increase in a reverse recovery current can be prevented, and a switching loss caused in the diode element domain can be decreased.
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