Invention Grant
- Patent Title: Printed circuit board having electromagnetic bandgap structure
- Patent Title (中): 具有电磁带隙结构的印刷电路板
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Application No.: US12654307Application Date: 2009-12-16
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Publication No.: US08253025B2Publication Date: 2012-08-28
- Inventor: Han Kim , Mi-Ja Han , Dae-Hyun Park
- Applicant: Han Kim , Mi-Ja Han , Dae-Hyun Park
- Applicant Address: KR Suwon
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon
- Priority: KR10-2009-0087645 20090916
- Main IPC: H05K9/00
- IPC: H05K9/00

Abstract:
Disclosed is a printed circuit board including an electromagnetic bandgap structure. The electromagnetic bandgap structure for blocking a noise is inserted into the printed circuit board. The electromagnetic bandgap structure can include a first conductive plate; a second conductive plate arranged on a planar surface that is different from that of the first conductive plate; a third conductive plate arranged on a planar surface that is different from that of the second conductive plate; and a stitching via unit configured to connect the first conductive plate and the third conductive plate by bypassing the planar surface on which the second conductive plate is arranged and including a first inductor element.
Public/Granted literature
- US20110061925A1 Printed circuit board having electromagnetic bandgap structure Public/Granted day:2011-03-17
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