Invention Grant
- Patent Title: Method for forming antimony-based FETs monolithically
- Patent Title (中): 一体形成锑基FET的方法
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Application No.: US12694002Application Date: 2010-01-26
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Publication No.: US08253167B2Publication Date: 2012-08-28
- Inventor: Heng-Kuang Lin , Pei-Chin Chiu , Jen-Inn Chyi , Han-Chieh Ho , Clement Hsingjen Wann , Chih-Hsin Ko , Cheng-Hsien Wu
- Applicant: Heng-Kuang Lin , Pei-Chin Chiu , Jen-Inn Chyi , Han-Chieh Ho , Clement Hsingjen Wann , Chih-Hsin Ko , Cheng-Hsien Wu
- Applicant Address: TW Hsin-Chu TW Jhongli
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.,National Central University
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.,National Central University
- Current Assignee Address: TW Hsin-Chu TW Jhongli
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L27/092
- IPC: H01L27/092

Abstract:
An integrated circuit structure includes a substrate and a first and a second plurality of III-V semiconductor layers. The first plurality of III-V semiconductor layers includes a first bottom barrier over the substrate; a first channel layer over the first bottom barrier; and a first top barrier over the first channel layer. A first field-effect transistor (FET) includes a first channel region, which includes a portion of the first channel layer. The second plurality of III-V semiconductor layers is over the first plurality of III-V semiconductor layers and includes a second bottom barrier; a second channel layer over the second bottom barrier; and a second top barrier over the second channel layer. A second FET includes a second channel region, which includes a portion of the second channel layer.
Public/Granted literature
- US20110180846A1 Method for Forming Antimony-Based FETs Monolithically Public/Granted day:2011-07-28
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