Invention Grant
- Patent Title: Heat-transfer mechanism and information device
- Patent Title (中): 传热机构和信息装置
-
Application No.: US12760849Application Date: 2010-04-15
-
Publication No.: US08254128B2Publication Date: 2012-08-28
- Inventor: Maiko Yasui
- Applicant: Maiko Yasui
- Applicant Address: JP Tokyo
- Assignee: Ricoh Company, Ltd.
- Current Assignee: Ricoh Company, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2009-101703 20090420
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H05K7/00 ; F28F7/00 ; H01L23/495 ; H01L23/34
Abstract:
A heat-transfer mechanism which transfers heat of a heat-generating component mounted on a board to a housing includes a heat-transfer plate having a bottom face portion which has contact with the heat-generating component, a first heat-transfer portion which is screwed near one end portion of the housing and a second heat-transfer portion which is screwed near the other end portion of the housing.
Public/Granted literature
- US20100263851A1 HEAT-TRANSFER MECHANISM AND INFORMATION DEVICE Public/Granted day:2010-10-21
Information query
