Invention Grant
- Patent Title: Manufacturing method for a thermal head
- Patent Title (中): 热头制造方法
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Application No.: US12589139Application Date: 2009-10-19
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Publication No.: US08256099B2Publication Date: 2012-09-04
- Inventor: Noriyoshi Shoji , Norimitsu Sanbongi , Yoshinori Sato , Toshimitsu Morooka , Keitaro Koroishi
- Applicant: Noriyoshi Shoji , Norimitsu Sanbongi , Yoshinori Sato , Toshimitsu Morooka , Keitaro Koroishi
- Applicant Address: JP
- Assignee: Seiko Instruments Inc.
- Current Assignee: Seiko Instruments Inc.
- Current Assignee Address: JP
- Agency: Adams & Wilks
- Priority: JP2008-269765 20081020
- Main IPC: H05B3/00
- IPC: H05B3/00

Abstract:
The manufacturing method for a thermal head includes: forming a hollow concave portion and a marking concave portion having a depth larger than a depth of the hollow concave portion on one surface of a thin plate glass; a bonding step of bonding a supporting plate onto the one surface of the thin plate glass, in which the hollow concave portion and the marking concave portion are formed in the concave portion forming step; a thinning step of thinning the thin plate glass onto which the supporting plate is bonded in the bonding step until the marking concave portion extends through the substrate from a side of a back surface opposite to the one surface; and a heating resistor forming step of forming a heating resistor on the back surface of the thin plate glass thinned in the thinning step so as to be opposed to the hollow concave portion.
Public/Granted literature
- US20100115760A1 Manufacturing method for a thermal head Public/Granted day:2010-05-13
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