A bonding method uses a bonding apparatus, which includes a frame, a first feeding mechanism, a second feeding mechanism, and a bonding mechanism. The first feeding mechanism is mounted on the frame and includes a turntable capable of rotating relative to the frame. A plurality of workpiece seats are arranged on the turntable. Each workpiece seat defines a plurality of air holes. The second feeding mechanism is mounted on the frame and includes a first carrier and a second carrier. The first carrier includes a plurality of holding seats and the second carrier including a plurality of temporary holding seats. The first carrier is capable of rotating to stack on the second carrier. The bonding mechanism is movably mounted on the frame to correspond to the workpiece seats or the second carrier.