The present invention provides a substrate treatment apparatus which sets substrate loading intervals to treatment chambers to a fixed value and prevents the occurrence of stagnancy of substrates in the treatment chambers. The substrate treatment apparatus includes a substrate conveyance chamber 5 which has a substrate conveyance device 11, a plurality of treatment chambers 6 to 9 in which a treatment time of at least one treatment chamber differs from treatment times of other treatment chambers and the respective treatment chambers are communicated with the conveyance chamber, and a control part 12 which controls a conveyance operation of the substrate conveyance device by setting treatment schedules of the substrates. In sequentially treating a plurality of substrates by the treatment chambers based on the preset same treatment schedule, the control part, using a time corresponding to a sum of the treatment time of the treatment chamber having the longest treatment time out of the treatment chambers predetermined during the treatment schedule and conveyance times before and after the treatment time with respect to the treatment chamber as a reference substrate loading interval, sets the substrate loading interval of respective substrates to the firstly loaded treatment chamber.