发明授权
- 专利标题: Optical film cutting method, and apparatus using the same
- 专利标题(中): 光学薄膜切割方法及使用其的装置
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申请号: US12670976申请日: 2008-08-19
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公开(公告)号: US08257638B2公开(公告)日: 2012-09-04
- 发明人: Kouta Nakai , Junpei Kozasa , Masahiro Hosoi
- 申请人: Kouta Nakai , Junpei Kozasa , Masahiro Hosoi
- 申请人地址: JP Osaka JP Saitama
- 专利权人: Nitto Denko Corporation,Akebono Machine Industries Co., Ltd.
- 当前专利权人: Nitto Denko Corporation,Akebono Machine Industries Co., Ltd.
- 当前专利权人地址: JP Osaka JP Saitama
- 代理机构: Cheng Law Group, PLLC
- 国际申请: PCT/JP2008/064745 WO 20080819
- 国际公布: WO2010/021024 WO 20100225
- 主分类号: B29C35/10
- IPC分类号: B29C35/10 ; B23K26/38
摘要:
A suction table 9 is disposed at a cutting action position for a polarizing film F, and holding blocks 9a and 9b, which are different in height from each other, are disposed in proximity to each other along a transport direction on a surface of the suction table 9 to form a suction groove 14. Nip rollers 11 and 12 are disposed on front and rear sides of the suction table 9 to nip opposed ends of the polarizing film F. Further, the suction table 9 suction-holds the polarizing film F in a state that the polarizing film F is inclined with the suction groove 14 located below a portion to be cut. In this state, a laser device 10 scans the polarizing film F along the suction groove 14 to cut the polarizing film F in a width direction.