Invention Grant
- Patent Title: Micro-electro-mechanical systems (MEMS) device
- Patent Title (中): 微机电系统(MEMS)装置
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Application No.: US12014810Application Date: 2008-01-16
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Publication No.: US08258591B2Publication Date: 2012-09-04
- Inventor: Chien-Hsing Lee , Tsung-Min Hsieh
- Applicant: Chien-Hsing Lee , Tsung-Min Hsieh
- Applicant Address: TW Hsinchu
- Assignee: Solid State System Co., Ltd.
- Current Assignee: Solid State System Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Jianq Chyun IP Office
- Main IPC: H01L29/84
- IPC: H01L29/84

Abstract:
The present invention provides a MEMS device, be implemented on many MEMS device, such as MEMS microphone, MEMS speaker, MEMS accelerometer, MEMS gyroscope. The MEMS device includes a substrate. A dielectric structural layer is disposed over the substrate, wherein the dielectric structural layer has an opening to expose the substrate. A diaphragm layer is disposed over the dielectric structural layer, wherein the diaphragm layer covers the opening of the dielectric structural layer to form a chamber. A conductive electrode structure is adapted in the diaphragm layer and the substrate to store nonvolatile charges.
Public/Granted literature
- US20090179233A1 MICRO-ELECTRO-MECHANICAL SYSTEMS (MEMS) DEVICE Public/Granted day:2009-07-16
Information query
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